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US 2025/0096145 A1Published application
Electronic packaging structure
AssigneeUnimicron Technology Corp.
InventorsChin-Sheng Wang, Ra-Min Tain, Chih-Kai Chan, Chun-Hsien Chien
Life of this patent
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Abstract
An electronic packaging structure including a first circuit structure and a second circuit structure is provided. An electronic component is disposed between the first circuit structure and the second circuit structure. At least one of the first circuit structure and the second circuit structure (for example, the second circuit structure) has a cavity. The electronic component is embedded in the cavity, and may be encapsulated between the first circuit structure and the second circuit structure.
Claims10
An electronic packaging structure, comprising:
- a first circuit structure;
- a second circuit structure;
- and
- a first electronic component located between the first circuit structure and the second circuit structure,
- wherein at least one of the first circuit structure and the second circuit structure has a cavity, and the first electronic component is embedded in the cavity.
2 more elements
Dependencies are inferred from the claim text.