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US 2025/0096144 A1Published application
Package substrate and semiconductor structure with same
AssigneeChangxin Memory Technologies, Inc.
InventorHailin WANG
Life of this patent
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Abstract
A package substrate is provided. The package substrate includes a body and a plurality of conducive bridges. The body includes an opening region. The plurality of conductive bridges are disposed separately in the opening region, and the plurality of conductive bridges comprise: a first conductive bridge provided with at least two first through holes.
Claims20
A package substrate, comprising:
- a body including an opening region;
- and
- a plurality of conductive bridges disposed separately in the opening region;
- and,
- wherein, the plurality of conductive bridges comprise:
- a first conductive bridge provided with at least two first through holes.
3 more elements
A package substrate, comprising:
- a body including an opening region and a vent hole;
- and
- a plurality of conductive bridges disposed separately in the opening region, a gap is provided between the adjacent conductive bridges;
- and,
- wherein the plurality of conductive bridges comprise:
- a first conductive bridge provided with at least two first through holes;
- and
- the vent hole is opposite to the gap.
5 more elements
A package substrate, comprising:
- a body including an opening region, a vent hole and conductive layer;
- and
- a plurality of conductive bridges disposed separately in the opening region, a gap is provided between the adjacent conductive bridges;
- and,
- wherein the plurality of conductive bridges comprise:
- a first conductive bridge provided with at least two first through holes;
- the vent hole is opposite to the gap;
- and
- the conductive layer is disposed around the opening region.
6 more elements
Dependencies are inferred from the claim text.