Back to results
US 2025/0096142 A1Published application
Electro-optic bridge chips for chip-to-chip communication
AssigneeGlobalFoundries U.S. Inc.
InventorJae Kyu Cho
Life of this patent
Estimating the term…
Abstract
Structures including an electro-optic bridge chip and methods of forming such structures. The structure comprises a photonics chip and an electro-optic bridge chip on a package substrate. The electro-optic bridge chip includes a waveguide core and an electrical trace line. A portion of the waveguide core is coupled to an optical coupler of the photonics chip.
Claims20
A structure comprising:
- a package substrate;
- a first photonics chip on the package substrate, the first photonics chip including an optical coupler and a bond pad;
- and
- an electro-optic bridge chip on the package substrate, the electro-optic bridge chip including a waveguide core and an electrical trace line, the electrical trace line coupled to the bond pad of the first photonics chip, and the waveguide core including a first portion that is coupled to the optical coupler of the first photonics chip.
1 more element
A method comprising:
- forming an electro-optic bridge chip including a waveguide core and an electrical trace line;
- attaching the electro-optic bridge chip to a package substrate;
- and
- attaching a first photonics chip to the package substrate, wherein the first photonics chip includes an optical coupler, and the waveguide core includes a first portion that is coupled to the optical coupler of the first photonics chip.
1 more element
Dependencies are inferred from the claim text.