Semiconductor device, resistive device, and method of obtaining electrical characteristics of semiconductor device
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWEI-LIN LAI, SZU-LIN LIU
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWEI-LIN LAI, SZU-LIN LIU
Estimating the term…
The present disclosure provides a resistive device. The resistive device includes a conductive structure, a row of first vias, and a row of second vias. The conductive structure has a first side and a second side opposite to the first side, and a first surface connected between the first side and the second side. The row of first vias extends through the conductive structure in a first direction substantially perpendicular to the first surface. The row of first vias is closer to the first side than the second side. The row of second vias extends through the conductive structure in the first direction. The row of second vias is disposed between the first side of the conductive structure and the row of first vias.
A resistive device, comprising:
A semiconductor device, comprising:
A method of obtaining electrical characteristics of a semiconductor device, comprising:
Dependencies are inferred from the claim text.