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US 2025/0096118 A1Published application
Semiconductor device
AssigneeKioxia Corporation
InventorKunio OTA
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Abstract
A semiconductor device includes an interposer substrate including a plurality of wiring layers inside, a first semiconductor chip disposed on the interposer substrate, and a power circuit configured to transform externally supplied voltage and supply the transformed voltage to the first semiconductor chip. The power circuit includes an inductor and a capacitor, the inductor being constituted by a plurality of coil patterns respectively formed in at least two of the plurality of wiring layers.
Claims20
A semiconductor device comprising:
- an interposer substrate including a plurality of wiring layers inside;
- a first semiconductor chip disposed on the interposer substrate;
- and
- a power circuit configured to transform externally supplied voltage and supply the transformed voltage to the first semiconductor chip,
- wherein the power circuit includes:
- an inductor constituted by a plurality of coil patterns respectively formed in at least two of the plurality of wiring layers of the interpose substrate;
- and
- a capacitor.
5 more elements
Dependencies are inferred from the claim text.