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US 2025/0096107 A1Published application
Semiconductor package and fabricating method thereof
AssigneeAmkor Technology Singapore Holding Pte. Ltd.
InventorsMichael Kelly, David Hiner, Ronald Huemoeller, Roger St. Amand
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Abstract
A semiconductor device structure and a method for making a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a thin fine-pitch redistribution structure.
Claims2
A semiconductor device comprising:
- a redistribution structure;
- a first semiconductor die attached to the first redistribution layer;
- a second semiconductor die attached to the first redistribution layer;
- and
- conductive interconnection structures attached to the second redistribution layer.
2 more elements
A method comprising:
- providing a redistribution structure;
- providing a first semiconductor die attached to the first redistribution layer;
- providing a second semiconductor die attached to the first redistribution layer;
- and
- providing conductive interconnection structures attached to the second redistribution layer.
2 more elements
Dependencies are inferred from the claim text.