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US 2025/0096105 A1Published application
Package substrate and fabricating method thereof
AssigneeAaltoSemi Inc.
InventorsMin-Yao CHEN, Yin-Ju CHEN, Sung-Kun LIN, Jiun-Hua CHIUE, Andrew C. CHANG, Chung-Hsier YANG, Zhen-Hu CHANG
Life of this patent
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Abstract
A package substrate is provided, in which dielectric layers are formed on a core board, and a wiring layer is embedded in at least one of the dielectric layers, so that the wiring layer has better copper adhesion to prevent delamination problems. A method of fabricating the package substrate is also provided.
Claims10
A package substrate, comprising:
- a core board having a first side and a second side opposing the first side, and at least one conductive via connecting the first side and the second side, wherein a first circuit layer electrically connected to the conductive via is formed on the first side and the second side of the core board;
- a dielectric layer formed on the first side and the second side of the core board and covering the first circuit layer;
- a wiring layer embedded in at least one of the dielectric layers on the first side and the second side of the core board;
- and
- conductive pillars formed in the dielectric layer and electrically connected to the wiring layer and the first circuit layer.
2 more elements
A method of fabricating a package substrate, comprising:
- providing a core board having a first side and a second side opposing the first side, and at least one conductive via connecting the first side and the second side, wherein a first circuit layer electrically connected to the conductive via is formed on the first side and the second side of the core board;
- forming a dielectric layer on the first side and the second side of the core board to cover the first circuit layer;
- laminating a wiring layer into at least one of the dielectric layers on the first side and the second side of the core board;
- and
- forming conductive pillars in the dielectric layer, wherein the conductive pillars are electrically connected to the wiring layer and the first circuit layer.
2 more elements
Dependencies are inferred from the claim text.