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US 2025/0096104 A1Published application
Package substrate and fabricating method thereof
AssigneeAaltoSemi Inc.
InventorsMin-Yao CHEN, Yin-Ju CHEN, Andrew C. CHANG
Life of this patent
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Abstract
A package substrate is provided, in which conductive pillars are formed on a circuit layer of a core board body, and an insulating layer encapsulates the conductive pillars in such a manner that the conductive pillars are exposed from a surface of the insulating layer for use as external contacts. Hence, there is no need to fabricate a wiring layer on the insulating layer. Consequently, a thickness of the package substrate is smaller to meet the requirements of thinning.
Claims10
A package substrate, comprising:
- a core board body having a first side and a second side opposing the first side, wherein the core board body has a plurality of conductive vias communicating with the first side and the second side, and a circuit layer electrically connecting the plurality of conductive vias is formed on the first side and the second side of the core board body;
- a plurality of conductive pillars disposed on the circuit layer on the first side and the second side of the core board body and electrically connected to the circuit layer, wherein a seeding layer is formed around a periphery of and at a bottom of each of the plurality of conductive pillars;
- and
- an insulating layer formed on the first side and the second side of the core board body and encapsulating the plurality of conductive pillars, wherein the plurality of conductive pillars are exposed from a surface of the insulating layer.
1 more element
A method of fabricating a package substrate, comprising:
- providing a core board body having a first side and a second side opposing the first side, wherein the core board body has a plurality of conductive vias communicating with the first side and the second side, and a circuit layer electrically connecting the plurality of conductive vias is formed on the first side and the second side of the core board body;
- forming a plurality of conductive pillars on the circuit layer on the first side and the second side of the core board body, and electrically connecting the plurality of conductive pillars to the circuit layer, wherein a seeding layer is formed around a periphery of and at a bottom of each of the plurality of conductive pillars;
- and
- forming an insulating layer on the first side and the second side of the core board body to encapsulate the plurality of conductive pillars, wherein the plurality of conductive pillars are exposed from a surface of the insulating layer.
1 more element
Dependencies are inferred from the claim text.