Semiconductor storage device and method of heating semiconductor storage device

A method of heating a semiconductor storage device,

• the semiconductor storage device comprising:
• a substrate having a first surface;
• a seal member covering the first surface when viewed from a first direction, the first direction being a thickness direction of the substrate;
• a first memory chip between the first surface and the seal member in the first direction;
• and
• a non-signal wiring different from a signal wiring of the semiconductor storage device, wherein
• the non-signal wiring is on one or more of a surface of the seal member, the inside of the seal member, the first surface of the substrate, the inside of the substrate, and a surface of the first memory chip,
• the non-signal wiring overlaps the first memory chip when viewed from the first direction,
• the non-signal wiring has a first portion, a second portion, and a third portion,
• the first portion extends in a second direction intersecting the first direction,
• the second portion is folded back from an end of the first portion to a first side in the second direction,
• the second portion extends parallel to the first portion,
• the third portion is folded back from an end of the second portion to a second side in the second direction,
• the second side is a side opposite to the first side in the second direction, and
• the third portion extends parallel to the second portion, and wherein
• the method causing a current to flow through the non-signal wiring.

A semiconductor storage device comprising:

• a substrate having a first surface;
• a seal member covering the first surface when viewed from a first direction, the first direction being a thickness direction of the substrate;
• a first memory chip between the first surface and the seal member in the first direction;
• and
• an electromagnetic-induction-heating metal portion on a surface of the seal member or inside the seal member, the electromagnetic-induction-heating metal portion overlapping the first memory chip when viewed from the first direction.

A method of heating a semiconductor storage device,

• the semiconductor storage device comprising:
• a substrate having a first surface;
• a seal member covering the first surface when viewed from a first direction, the first direction being a thickness direction of the substrate;
• a first memory chip between the first surface and the seal member in the first direction;
• and
• a metal portion on a surface of the seal member or inside the seal member, the metal portion overlapping the first memory chip when viewed from the first direction, wherein
• the method comprising:
• providing a coil so as to face the semiconductor storage device;
• and
• the method causing the metal portion to generate heat by electromagnetic induction heating.