Chip-substrate composite semiconductor device

A method of manufacturing a plurality of semiconductor devices, the method comprising:

• providing a semiconductor substrate comprising a front side and a backside, wherein a plurality of first electrodes is disposed on the front side of the semiconductor substrate;
• providing an inorganic substrate comprising a first side and a second side opposite the first side;
• forming a grid of trenches in the first side of the inorganic substrate, the grid of trenches defining a pattern of pedestals at the first side;
• forming a metal layer over the first side of the inorganic substrate, wherein the metal layer extends over pedestals and side walls of the trenches;
• attaching the semiconductor substrate to the inorganic substrate by bonding the plurality of first electrodes to the structured metal layer;
• thinning the semiconductor substrate to obtain a thinned semiconductor substrate;
• separating the thinned semiconductor substrate into a plurality of semiconductor chips;
• and
• separating the inorganic substrate into the plurality of semiconductor devices.