US 2025/0096100 A1 · Chip with Top Metal Pad Pitch Adjustment

Abstract

Methods, systems, and apparatuses for a package with top metal pad pitch adjustment are described. A first portion of an integrated circuit (e.g., including transistors and other devices) may have a first pitch associated with internal connections. The first pitch may not align with the pitch of a desired external connection. Accordingly, a set of masks may be used to add a second portion of an integrated circuit (e.g., metal wiring) to the integrated circuit such that the integrated circuit obtains a second pitch, different than the first pitch. The first portion of the integrated circuit may be consistent across one or more integrated circuits while the second portion of the integrated circuit may be customizable for the desired external connections associated with that integrated circuit.

Claims20

Dependent claims

A method of packaging an integrated circuit comprising:

forming a set of devices of the integrated circuit;
forming a set of internal connections of the integrated circuit that are coupled to the set of devices of the integrated circuit;
selecting a set of masks from a library of sets of masks;
forming a set of metal wiring layers of the integrated circuit using the set of masks;
and
coupling a set of external connections of the integrated circuit to the set of internal connections via the metal wiring layers;
wherein:
(i) the sets of masks in the library of sets of masks are configured to form different sets of metal wiring layers;
and (ii) the different sets of metal wiring layers differ in how they connect the internal connections of the integrated circuit to the external connections of the integrated circuit.

6 more elements

A method comprising:

forming a first set of devices of a first integrated circuit;
forming a first set of internal connections of the first integrated circuit that are coupled to the first set of devices of the first integrated circuit;
selecting a first set of masks from a library of sets of masks based at least in part on a first set of external connections;
forming a first set of metal wiring layers of the first integrated circuit using the first set of masks;
forming a second set of devices of a second integrated circuit, wherein the second set of devices is in a same configuration as a configuration of the first set of devices;
forming a second set of internal connections of the second integrated circuit that are coupled to the second set of devices of the second integrated circuit;
selecting a second set of masks from the library of sets of masks based at least in part on a second set of external connections, wherein the second set of masks is different than the first set of masks and the second set of external connections has a different configuration than a configuration of the first set of external connections;
and
forming a second set of metal wiring layers of the second integrated circuit using the second set of masks, wherein the second integrated circuit has a configuration that is different than a configuration of the first set of metal wiring layers.

6 more elements

Dependencies are inferred from the claim text.

Chip with Top Metal Pad Pitch Adjustment

Life of this patent

Chip with Top Metal Pad Pitch Adjustment

Life of this patent

Abstract

Claims20