Semiconductor package and method for manufacturing the same

A semiconductor package, comprising:

• a first semiconductor structure, including:
• a first substrate;
• a first semiconductor stacking structure on the first substrate;
• and
• a plurality of second semiconductor stacking structures on the first substrate and disposed on at least on two opposite sides of the first semiconductor stacking structure;
• a second semiconductor structure on the first semiconductor structure, including:
• a second substrate;
• and
• an RFIC chip, a DDI chip, a sensor chip, and a PMIC chip on the second substrate;
• a plurality of core balls between the first substrate and the second substrate and electrically connecting the first semiconductor structure and the second semiconductor structure;
• a first molding material covering the first semiconductor stacking structure, the plurality of second semiconductor stacking structures, and the plurality of core balls between the first substrate and the second substrate;
• and
• a second molding material covering the RFIC chip, the DDI chip, the sensor chip, and the PMIC chip on the second substrate.