Package comprising a substrate with via interconnect with vertical walls

A package comprising:

• an integrated device;
• and
• a substrate coupled to the integrated device, the substrate comprising:
• at least one dielectric layer;
• and
• a plurality of interconnects located at least partially in the at least one dielectric layer,
• wherein the plurality of interconnects include a plurality of via interconnects, and
• wherein the plurality of via interconnects include a first via interconnect comprising a first via wall that is approximately vertical.

A method for fabricating a substrate, comprising:

• forming a first plurality of interconnects for a first metal layer;
• forming a first plurality of via interconnects coupled to the first plurality of interconnects;
• forming a first dielectric layer around the first plurality of interconnects and the first plurality of via interconnects;
• thinning the first dielectric layer;
• and
• forming a second plurality of interconnects for a second metal layer,
• wherein the second plurality of interconnects are coupled to the first plurality of via interconnects, and
• wherein the second plurality of interconnects are located laterally to part of the first plurality of via interconnects.