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US 2025/0096090 A1Published application
Integrated device comprising silicon substrate with porous portion
AssigneeQUALCOMM Incorporated
InventorsRanadeep DUTTA, Jonghae KIM, Je-Hsiung LAN
Life of this patent
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Abstract
An integrated device comprising a die substrate comprising a porous portion; a plurality of through substrate vias extending through the porous portion of the die substrate; and a die interconnection portion coupled to the die substrate.
Claims33
An integrated device comprising:
- a die substrate comprising a porous portion;
- a plurality of through substrate vias extending through the porous portion of the die substrate;
- and
- a die interconnection portion coupled to the die substrate.
1 more element
A package comprising:
- an interposer;
- and
- a first integrated device coupled to the interposer through at least a plurality of solder interconnects, wherein the first integrated device comprises:
- a die substrate comprising a porous portion;
- a plurality of through substrate vias extending through the porous portion of the die substrate;
- and
- a die interconnection portion coupled to the die substrate.
4 more elements
A package comprising:
- a substrate;
- and
- a first integrated device coupled to the substrate through at least a plurality of solder interconnects, wherein the first integrated device comprises:
- a die substrate comprising a porous portion;
- a plurality of through substrate vias extending through the porous portion of the die substrate;
- and
- a die interconnection portion coupled to the die substrate.
4 more elements
Dependencies are inferred from the claim text.