Semiconductor package and electronic device

Abstract

To improve reliability by securing drop test characteristics or impact resistance in a semiconductor package. A semiconductor package includes a plurality of insulating layers and an under bump metal layer. The under bump metal layer is a metal layer connected to a bump. The under bump metal layer is partially exposed at the opening of the outermost layer among the plurality of insulating layers, and is connected to the bump at the exposed portion. The diameter of the under bump metal layer is larger than the diameter of the opening of the outermost layer. As a result, the under bump metal layer inhibits or reduces transmission of force to the land or RDL via the bump.

Dependencies are inferred from the claim text.