Integrated stacked substrate for isolated power module

A method of forming a microelectronic device, comprising:

• providing a lead frame having a die pad, leads, a first thermal shunt connecting the die pad to a first lead of the leads, and a second thermal shunt connecting the die pad to a second lead of the leads;
• attaching a first component to a first surface of the die pad through a first thermally conductive material;
• and
• attaching a second component to a second surface of the die pad, opposite from the first surface, through a second thermally conductive material;
• wherein:
• the die pad, the leads, the first thermal shunt, and the second thermal shunt are electrically conductive;
• at least a portion of the second component overlaps at least a portion of the first component;
• the first thermal shunt is closer to a center of the first component than to a center of the second component;
• and
• the second thermal shunt is closer to a center of the second component than to a center of the first component.

A microelectronic device, comprising:

• a first die pad having a first surface and a second surface opposite from the first surface, the first die pad being electrically conductive;
• a first component directly attached to the first surface of the first die pad through a first thermally conductive material;
• a second die pad having a third surface and a fourth surface opposite from the third surface, the third surface being coplanar with the first surface of the first die pad and the fourth surface being coplanar with the second surface of the first die pad, the second die pad being electrically conductive;
• a second component directly attached to the fourth surface of the second die pad through a second thermally conductive material, wherein at least a portion of the second component overlaps at least a portion of the first component;
• leads extending to an exterior of the microelectronic device, the leads being electrically conductive;
• a first thermal shunt connecting the first die pad to a first lead of the leads, the first thermal shunt being electrically conductive;
• and
• a second thermal shunt connecting the second die pad to a second lead of the leads, the second thermal shunt being electrically conductive.

A method of forming a microelectronic device, comprising:

• providing a lead frame having a first die pad, a second die pad, leads, a first thermal shunt connecting the first die pad to a first lead of the leads, and a second thermal shunt connecting the second die pad to a second lead of the leads;
• wherein:
• the leads, the first and second die pads, and the first and second thermal shunts are electrically conductive;
• the first die pad has a first surface and a second surface opposite from the first surface;
• and
• the second die pad has a third surface coplanar with the first surface of the first die pad and a fourth surface opposite from the first surface, the fourth surface being coplanar with the second surface of the first die pad;
• attaching a first component to the first surface of the first die pad through a first thermally conductive material;
• and
• attaching a second component to the fourth surface of the second die pad through a second thermally conductive material, wherein at least a portion of the second component overlaps at least a portion of the first component.