Semiconductor device and method of manufacturing the same

A semiconductor device comprising:

• (a) preparing a die pad having a first surface;
• (b) mounting a semiconductor chip on the first surface of the die pad via a die bond material;
• and
• (c) sealing the semiconductor chip, the die bond material and the first surface of the die pad with a sealing body containing a resin,
• wherein, in a plan view, the semiconductor chip mounted on the die pad in (b) is comprised of a quadrangle having:
• four sides;
• four corners where any two of the four sides intersect with each other;
• and
• two diagonal lines,
• wherein, in plan view, the first surface of the die pad prepared in (a) has:
• a first region that includes a point overlapping with a center of the semiconductor chip;
• a second region that is located around the first region and that includes points overlapping with the four corners, respectively;
• and
• a third region that is located around the second region,
• wherein a plurality of grooves is formed in the die pad at the second region by irradiating with a laser,
• wherein each of the plurality of grooves terminates at a position not reaching each of the first region and the third region,
• wherein the plurality of grooves includes:
• a plurality of first grooves each extending in an extending direction of one of the two diagonal lines;
• and
• a plurality of second grooves each extending in an extending direction of another one of the two diagonal lines,
• wherein each of the plurality of first grooves is arranged so as to intersect with one or more of the plurality of second grooves,
• wherein each of the four sides of the semiconductor chip overlaps with one or more of the plurality of grooves, and wherein the (b) includes:
• (b1) applying the die bond material onto the first region of the die pad;
• (b2) pressing the die bond material applied in the first region with the semiconductor chip, and making the die bond material adhere to both the semiconductor chip and the die pad;
• and
• (b3) curing the die bond material, and fixing the semiconductor chip onto the die bond material.