Semiconductor device with enhanced solderability and method therefor

A semiconductor device comprising:

• a leadframe including a die pad and a plurality of leads, the die pad having a central opening through the die pad;
• a semiconductor die mounted on the die pad of the leadframe, a portion of the semiconductor die exposed through the central opening;
• and
• an encapsulant encapsulating with the semiconductor die and the leadframe, a portion of the die pad and plurality of leads exposed and protruded through the encapsulant.

A method of comprising:

• mounting a semiconductor die on a die pad of a leadframe, the die pad having a central opening exposing a backside portion of the semiconductor die;
• attaching a first end of a bond wire to a bond pad of the semiconductor die and a second end of the bond wire to a lead of the leadframe;
• interconnecting a component with a through-silicon via (TSV) of the semiconductor die, the component located substantially within the central opening of the die pad;
• and
• encapsulating with an encapsulant the semiconductor die, the leadframe, and the component.