Backside offset gate contact for backside spacing
AssigneeInternational Business Machines Corporation
InventorsRuilong Xie, Albert M Chu, Brent A. Anderson, Lawrence A. Clevenger
Life of this patent
Estimating the term…
Loading patent…
AssigneeInternational Business Machines Corporation
InventorsRuilong Xie, Albert M Chu, Brent A. Anderson, Lawrence A. Clevenger
Estimating the term…
Embodiments disclosed herein include a semiconductor structure. The semiconductor structure may include a front-end-of-line (FEOL) including a first source/drain (S/D) adjacent to a first gate. A device may include a backside interconnect below the FEOL, with a plurality of signal lines and a plurality of power lines. A device may include an offset gate contact electrically connected between the first gate and a first signal line of the plurality of signal lines, wherein the offset gate contact is located directly below the first S/D.
A semiconductor structure, comprising:
A method, comprising:
A semiconductor structure, comprising:
A semiconductor structure, comprising:
A semiconductor structure, comprising:
Dependencies are inferred from the claim text.