Integrated circuit cooling systems and methods

An integrated circuit system comprising:

• a circuit board having a top side and a bottom side and defining an opening from the top side to the bottom side;
• a semiconductor substrate having a front side and a back side, located over the top side of the circuit board, and including semiconductor devices on the front side;
• a voltage regulator module (VRM) on the back side of the semiconductor substrate and electrically connected to at least one of the semiconductor devices;
• a bottom thermally conductive member extending through the opening in the circuit board and in thermal communication with the VRM to dissipate heat away from the back side of the semiconductor substrate.

A method for fabricating a semiconductor package, the method comprising:

• forming an integrated circuit over a front side of a substrate;
• forming a voltage regulator module (VRM) on the back side of the substrate, wherein the VRM is electrically connected to the integrated circuit;
• thermally connecting the VRM to a bottom thermally conductive member;
• and
• thermally connecting the integrated circuit to a top thermally conductive member.