Semiconductor module

A semiconductor module comprising:

• a mounting substrate;
• a semiconductor device that is flip-chip mounted on the mounting substrate;
• a mold resin that seals the semiconductor device;
• and
• an insulating heat transfer member that is on a surface of the semiconductor device facing the mounting substrate and has a higher thermal conductivity than a thermal conductivity of the mold resin, wherein
• the semiconductor device includes
• a device layer including a transistor,
• a plurality of bumps that are on a surface of the device layer facing the mounting substrate and are connected to the mounting substrate, and
• an insulating layer that is on a surface of the device layer opposite to the surface facing the mounting substrate, and
• when the mounting substrate is viewed in plan view, the transistor has a non-overlapping portion not overlapping with any of the plurality of bumps, and the heat transfer member is continuous from a region overlapping with the non-overlapping portion to at least one of the plurality of bumps.