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US 2025/0096069 A1Published application
Power module and method of fabricating the same
AssigneeInfineon Technologies AG
InventorsAdrian Lis, Thomas Schmid, Ewald Günther
Life of this patent
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Abstract
A power module includes a substrate, one or more semiconductor dies mounted to the substrate, a first external power connection electrically connected to a first power terminal of at least one of the one or more semiconductor dies, and an encapsulant at least partially encapsulating the first external power connection. A portion of the first external power connection and at least parts of an outer surface of the substrate are exposed from the encapsulant. A heatsink is mounted to the first external power connection.
Claims17
A power module, comprising:
- a substrate;
- one or more semiconductor dies mounted to the substrate;
- a first external power connection electrically connected to a first power terminal of at least one of the one or more semiconductor dies;
- an encapsulant at least partially encapsulating the first external power connection, wherein a portion of the first external power connection and at least parts of an outer surface of the substrate are exposed from the encapsulant;
- and
- a heatsink mounted to the first external power connection.
3 more elements
A power module, comprising:
- a substrate;
- one or more semiconductor dies mounted to the substrate;
- a first external power connection electrically connected to a first power terminal of at least one of the one or more semiconductor dies;
- and
- an encapsulant at least partially encapsulating the first external power connection,
- wherein an external end portion of the first external power connection and at least parts of an outer surface of the substrate are exposed from the encapsulant,
- wherein parts of the external end portion of the first external power connection are bent to form a coplanar surface with the outer surface of the substrate that is exposed from the encapsulant.
4 more elements
Dependencies are inferred from the claim text.