Semiconductor device

Abstract

A semiconductor device, including: a first board and a second board facing each other with a space therebetween; a heat dissipation base having a front surface, on which the first board is bonded via a first f solder layer and the second board is bonded via a second solder layer; and a resist formed along the first solder layer and the second solder layer. The first solder layer has an edge portion thereof, which is a first edge portion, facing the second solder layer. The second solder layer has an edge portion thereof, which is a second edge portion, facing the first solder layer. The resist is in contact with the first edge portion and the second edge portion.

Dependencies are inferred from the claim text.