Method of manufacturing a cooling arrangement and cooling arrangement for power electronic components

A cooling arrangement for cooling power electronic components, comprising:

• a cooling device as a mounting platform for at least one power electronic component, the cooling device is further affixed at a metal component, wherein the cooling device has a first surface at its base section for mounting the at least one power electronic component and a second surface of the base section located opposite the first surface is provided with a cooling structure having cooling projections,
• wherein the base section and the cooling projections comprise a sintered substance, the cooling projections are are shaped from the substance of the base section, the metal component is a cast component and the base section of the cooling device is jointed at the metal cast component by welding or by soldering via a material bond and said jointing via a material bond simultaneously establishes a liquid-tight connection between the cooling device and the cast component.