Semiconductor device
AssigneeMitsubishi Electric Corporation
InventorsTatsuya UDA, Taketo NISHIYAMA
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AssigneeMitsubishi Electric Corporation
InventorsTatsuya UDA, Taketo NISHIYAMA
Estimating the term…
A semiconductor device includes a case that accommodates a semiconductor chip therein, a sealing material injected into the case, and a lid fitted into an opening of the case. The lid includes a first lid member and a second lid member that partially overlap each other. The first lid member has a first notch portion and a first convex portion in a portion overlapping with the second lid member. The second lid member has a second notch portion and a second convex portion in a portion overlapping with the first lid member. The first lid member and the second lid member are combined each other with the second convex portion being inserted into the first notch portion and the first convex portion being inserted into the second notch portion.
A semiconductor device comprising:
Dependencies are inferred from the claim text.