Substrate treatment apparatus having heating part

Abstract

The present disclosure relates to a substrate treatment apparatus including: a chuck base having a ring-shaped spin chuck with chuck pins disposed on top thereof to support a substrate and a chuck support part located on the lower portion of the inner peripheral surface of the spin chuck; a back nozzle assembly mounted through a hollow portion formed at the center of the chuck base to spray treatment liquid onto the underside of the substrate; cover glass disposed between top of the spin chuck and the back nozzle assembly; and a heating part located inside the inner peripheral surface of the spin chuck in a space between the cover glass and the chuck support part, wherein the spin chuck is separably coupled to the chuck support part in an up-down direction.

Dependencies are inferred from the claim text.