Substrate peeling device, substrate peeling method, and method of manufacturing semiconductor device
AssigneeKioxia Corporation
InventorYoshio MIZUTA
Life of this patent
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Abstract
According to one embodiment, a substrate peeling device including an adsorption stage and a light source is provided. A bonded body including multiple substrates is adsorbed to the adsorption stage. The adsorption stage includes a first region and a second region. The second region is inside the first region. The light source can sequentially apply a laser beam toward the first region and the second region. The adsorption stage has weaker power of adsorbing the bonded body in the second region than in the first region.
Claims20
A substrate peeling device comprising:
- an adsorption stage configured to adsorb a bonded body including multiple substrates and that includes a first region and a second region inside the first region;
- and
- a light source configured to sequentially apply a laser beam toward the first region and the second region,
- wherein the adsorption stage has weaker power of adsorbing the bonded body in the second region than in the first region.
A substrate peeling method comprising:
- preparing a first substrate;
- stacking a first film on the first substrate;
- stacking a second film on a second substrate;
- forming a bonded body by bonding a main surface opposite to the first substrate in the first film and a main surface opposite to the second substrate in the second film with each other;
- applying a laser beam from a side of the first substrate to the bonded body with the bonded body being adsorbed to an adsorption stage;
- and
- peeling the first substrate off the bonded body,
- wherein the adsorption stage includes a first region and a second region inside the first region, and has weaker power of adsorbing the bonded body in the second region than in the first region, and
- applying the laser beam toward the second region after applying the laser beam toward the first region.
A substrate peeling method comprising:
- preparing a first substrate;
- stacking a first film on the first substrate;
- stacking a second film on a second substrate;
- forming a bonded body by bonding a main surface opposite to the first substrate in the first film and a main surface opposite to the second substrate in the second film with each other;
- applying a laser beam from a side of the first substrate to the bonded body with the bonded body being adsorbed to an adsorption stage;
- and
- peeling the first substrate off the bonded body,
- wherein the adsorption stage includes a first region and a second region inside the first region, and
- the applying includes:
- applying the laser beam toward the first region with first energy;
- and
- applying the laser beam toward the second region with second energy smaller than the first energy after the applying to the first region.
Dependencies are inferred from the claim text.