Semiconductor Manufacturing Tool Alignment Device And Method

A method of aligning a wafer handling robot in a wafer processing system, the method comprising:

• placing an alignment device in the wafer handling robot, the alignment device being at a first position in the wafer processing system, and the alignment device comprising a substrate having a through-hole and a sensor mounted on a first surface of the substrate;
• capturing, utilizing the sensor via the through-hole, information relating to the first position of the alignment device;
• wirelessly transmitting, to a receiver by use of a transmitter of the alignment device, the information relating to the first position of the alignment device;
• determining, based on the information relating to the first position, whether the alignment device at the first position is within a threshold distance from a target position in the wafer processing system;
• and
• when the alignment device at the first position is beyond the threshold distance from the target position, determining, based on the first position and the target position, a first updated position for the alignment device in the wafer processing system, and moving the wafer handling robot to move the alignment device from the first position to the first updated position.

A frame for calibrating an alignment device, the alignment device comprising a substrate in a circular shape and a sensor mounted on a first surface of the substrate, the substrate having a through-hole in a center of the substrate, and the frame comprising:

• a base in a ring-shape;
• a plurality of radial arms extending from the base, each of the plurality of radial arms having a sidewall at a distant edge of a corresponding radial arm, and the plurality of radial arms extending to a length such that the sidewall is engageable with an edge of the substrate when the substrate is placed onto the frame with a second surface of the substrate facing a first surface of the frame, wherein the first surface and the second surface of the substrate being opposing surfaces;
• and
• a target suspended above a second surface of the frame and aligned with a center point of the frame, the first surface and the second surface of the frame being opposing surfaces, and the target being aligned with the through hole of the substrate such that a position of the camera on the substrate is adjusted based on images of the target taken by the sensor through the through-hole.