Substrate processing apparatus

A substrate processing apparatus comprising:

• a vacuum transfer module having a vacuum transfer space and an opening;
• and
• a flexible system attached to the opening of the vacuum transfer module and selectively including any one of a first replaceable unit, a second replaceable unit and a third replaceable unit,
• wherein the first replaceable unit includes:
• a first wall unit attached to the opening and including two first gate valves;
• and
• two substrate processing modules attached to the first wall unit, each substrate processing module having a substrate processing space and the substrate processing space communicating with the vacuum transfer space through the first gate valve,
• wherein the second replaceable unit includes:
• a second wall unit attached to the opening and including two second gate valves, and
• two ring stockers attached to the second wall unit, each ring stocker having a storage space for storing an annular member used in the plasma processing module, the storage space communicating with the vacuum transfer space through the second gate valve, and
• wherein the third replaceable unit includes:
• a third wall unit attached to the opening and including a first gate valve and a second gate valve, a width of the second gate valve being greater than a width of the first gate valve;
• a substrate processing module attached to the third wall unit and having a substrate processing space, the substrate processing space communicating with the vacuum transfer space through the first gate valve;
• and
• a ring stocker attached to the third wall unit and having a storage space for storing an annular member used in the plasma processing module, the storage space communicating with the vacuum transfer space through the second gate valve.