Substrate processing apparatus and substrate processing method

A substrate processing apparatus, comprising:

• a transfer device configured to transfer first and second half plates in order to perform a coating process;
• a loading stage configured to receive the first and second half plates from the transfer device, the loading stage including a first substrate alignment portion for aligning the first plate and a second substrate alignment portion for aligning the second plate, the second substrate alignment portion being arranged to be spaced apart from the first substrate alignment portion;
• a coating stage configured to sequentially receive the first half plate and the second half plate from the loading stage, the coating stage including a first discharge nozzle for discharging a first chemical solution onto the first half plate and a second discharge nozzle for discharging a second chemical solution onto the second half plate;
• and
• a loading stage configured to sequentially unload the first half plate and the second half plate from the loading stage.

A substrate processing apparatus, comprising:

• a transfer device configured to transfer first and second half plates in order to perform a coating process;
• a loading stage configured to receive the first and second half plates from the transfer device, the loading stage having a central region and first and second peripheral regions in both sides of the central region, the loading stage including a first substrate alignment portion and a second substrate alignment portion, wherein the first substrate alignment portion aligns the first half plate through a plurality of first central pins provided in the central region and a plurality of first peripheral pins provided in the first peripheral region, wherein the second substrate alignment portion aligns the second half plate through a plurality of second central pins provided in the central region and a plurality of second peripheral pins provided in the second peripheral region, the second central pins being arranged alternately with the first central pins;
• a coating stage configured to sequentially receive the first and second half plates from the loading stage, the coating stage having a first discharge nozzle for discharging a first chemical solution onto the first half plate and a second discharge nozzle for discharging a second chemical solution onto the second half plate, the coating stage being configured to selectively drive one of the first and second discharge nozzles;
• and
• an unloading stage configured to sequentially unload the first half plate and the second half plate from the coating stage to the outside.