Resin sealing device and resin sealing method

A resin sealing method, which is a compression molding type resin sealing method for sealing an electronic component of a workpiece comprising a substrate and the electronic component with resin, the resin sealing method comprising:

• calculating, for each workpiece, a resin amount of a resin material to be supplied to the workpiece based on a mounting state of the electronic component in the workpiece;
• supplying the workpiece to a resin sealing mold;
• supplying a resin material to the resin sealing mold;
• and
• sealing the electronic component with resin by compression molding the resin material on the workpiece by the resin sealing mold,
• wherein the resin material comprises a first resin and a second resin, the first resin is a sheet-like resin, the second resin is a granulated resin, a powdered resin, or a liquid resin, and
• a supply amount of at least the second resin among the first resin and the second resin is determined for each workpiece based on the resin amount of the resin material calculated for each workpiece.