Bevel sealing system and method of using the same
OwnerYu-Meng Ou, Kei-Wei Cheninventors
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Abstract
In an embodiment, a bevel sealing system includes a dispensing chamber that includes a first chuck configured to support a workpiece, the workpiece including a first wafer bonded to a second wafer, where the first wafer and the second wafer include beveled edges, a sealant dispenser configured to apply sealant along a perimeter of a bonding interface between the first wafer and the second wafer, a first Charge-Coupled Device (CCD) camera configured to capture 2-dimensional (2D) images of edges of the workpiece, and a first laser edge profiler configured to measure and collect profile data of the edges of the workpiece.
Claims20
A bevel sealing system comprising:
- a dispensing chamber comprising:
- a first chuck configured to support a workpiece, the workpiece comprising a first wafer bonded to a second wafer, wherein the first wafer and the second wafer comprise beveled edges;
- a sealant dispenser configured to apply sealant along a perimeter of a bonding interface between the first wafer and the second wafer;
- a first Charge-Coupled Device (CCD) camera configured to capture 2-dimensional (2D) images of edges of the workpiece;
- and
- a first laser edge profiler configured to measure and collect profile data of the edges of the workpiece.
A method of forming a bevel seal, the method comprising:
- bonding a front side of a device wafer to a carrier wafer to form a workpiece, wherein a first space is disposed between a first beveled edge of the device wafer and a second beveled edge of the carrier wafer, the first space also extending along a perimeter of a bonding interface between the device wafer and the carrier wafer;
- performing a first inspection of edges of the workpiece, wherein the first inspection comprises:
- capturing a first set of 2-dimensional (2D) images of the edges of the workpiece using a first Charge-Coupled Device (CCD) camera;
- and
- measuring and collecting a first set of profile data of the edges of the workpiece using a first laser edge profiler;
- and
- reconstructing a first 3-dimensional (3D) representation of the edges of the workpiece using the first set of 2D images of the edges of the workpiece and the first set of profile data of the edges of the workpiece.
A method comprising:
- bonding an interconnect structure of a first wafer to a second wafer to form a wafer stack, wherein a first space is disposed between a lower beveled edge of the second wafer and an upper beveled edge of the first wafer, the first space extending along a perimeter of a bonding interface between the first wafer and the second wafer;
- forming a bevel seal in the first space along the perimeter of the bonding interface between the first wafer and the second wafer, wherein forming the bevel seal comprises:
- measuring and collecting a first set of profile data of edges of the wafer stack using a first laser edge profiler;
- and
- reconstructing a first 3-dimensional (3D) representation of the edges of the wafer stack using the first set of profile data of the edges of the wafer stack;
- determining a volume of sealant to be dispensed into the first space in order to fill the first space, wherein the volume of the sealant to be dispensed into the first space is determined using the first 3D representation of the edges of the wafer stack;
- and
- dispensing the sealant into the first space that extends along the perimeter of the bonding interface between the first wafer and the second wafer.
Dependencies are inferred from the claim text.