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US 2025/0096012 A1Published application
Substrate processing module and substrate processing method
AssigneeEbara Corporation
InventorTomoatsu ISHIBASHI
Life of this patent
Estimating the term…
Abstract
A substrate processing module capable of improving a cleaning efficiency of an object to be cleaned is disclosed. The substrate processing module includes a gas supply device configured to supply a gas to a gap between a cleaning member and a surface to be cleaned. The gas supply device is configured to generate a fine bubble through the cleaning member.
Claims16
A substrate processing module for processing a substrate, comprising:
- a cleaning member having an open-cell foam structure;
- a gas supply device configured to supply a gas to a gap between the cleaning member and a surface to be cleaned of an object to be cleaned;
- and
- a liquid supply device configured to supply a liquid to the gap between the cleaning member and the surface to be cleaned,
- wherein the gas supply device is configured to generate a fine bubble through the open-cell foam structure while supplying the liquid from the liquid supply device.
2 more elements
A substrate processing method for processing a substrate, comprising:
- supplying a liquid to a gap between a cleaning member having an open-cell foam structure and a surface to be cleaned of an object to be cleaned;
- and
- supplying a fine bubble to the gap between the cleaning member and the surface to be cleaned through the open-cell foam structure while supplying the liquid.
Dependencies are inferred from the claim text.