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US 2025/0095995 A1Published application
Substrate processing method and substrate processing system
AssigneeTokyo Electron Limited
InventorsHayato TANOUE, Yohei YAMASHITA
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AssigneeTokyo Electron Limited
InventorsHayato TANOUE, Yohei YAMASHITA
Estimating the term…
A substrate processing method of processing a combined substrate in which a first substrate and a second substrate are bonded to each other includes forming a peripheral modification layer along a boundary between a peripheral portion of the first substrate as a removing target and a central portion of the first substrate; forming a non-bonding region in which bonding strength between the first substrate and the second substrate in the peripheral portion is reduced; and removing the peripheral portion starting from the peripheral modification layer. A first crack is developed from the peripheral modification layer toward the second substrate. The peripheral modification layer is formed such that a lower end of the first crack is located above the non-bonding region and an inner end of the non-bonding region is located at a diametrically outer side than the first crack.
A method of processing a combined substrate in which a first substrate and a second substrate are bonded to each other, the substrate processing method comprising:
A substrate processing system configured to process a combined substrate in which a first substrate and a second substrate are bonded to each other, the substrate processing system comprising:
Dependencies are inferred from the claim text.