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AssigneeKokusai Electric Corporation
InventorsTakeshi Yasui, Yukinori Aburatani
Estimating the term…
There is provided a technique that includes: a mounting table configured to be capable of mounting a substrate on the mounting table; a heater located above the mounting table and configured to radiate heat rays toward the substrate mounted on the mounting table to heat the substrate; a process container disposed below the heater and configured to accommodate the mounting table, wherein at least a portion of the process container, which is located adjacent to the heater, is made of opaque quartz; and a sealer configured such that transmission of heat rays reflected from the substrate to the sealer is suppressed by the at least a portion of the process container and airtightness between the process container and the heater is maintained by a seal.
A substrate processing apparatus, comprising:
A method of manufacturing a semiconductor device by using a substrate processing apparatus that includes a mounting table configured to be capable of mounting a substrate on the mounting table, a heater located above the mounting table and configured to radiate heat rays toward the substrate mounted on the mounting table to heat the substrate, a process container disposed below the heater, configured to accommodate the mounting table, wherein at least a portion of the process container, which is located adjacent to the heater, is made of opaque quartz, and a sealer configured such that transmission of heat rays reflected from the substrate to the sealer is suppressed by the at least a portion of the process container and airtightness between the process container and the heater is maintained by a seal, the method comprising:
A non-transitory computer-readable recording medium storing a program that causes, by a computer, a substrate processing apparatus, which includes a mounting table configured to be capable of mounting a substrate on the mounting table, a heater located above the mounting table and configured to radiate heat rays toward the substrate mounted on the mounting table to heat the substrate, a process container disposed below the heater, configured to accommodate the mounting table, wherein at least a portion of the process container, which is located adjacent to the heater, is made of opaque quartz, and a sealer configured such that transmission of heat rays reflected from the substrate to the sealer is suppressed by the at least a portion of the process container and airtightness between the process container and the heater is maintained by a seal, to perform a process comprising:
Dependencies are inferred from the claim text.