Semiconductor chamber components with advanced dual layer nickel-containing coatings

A method for a coating a component of a semiconductor processing system, the method comprising:

• forming a nickel-containing alloy on an exposed surface the component of the semiconductor processing system;
• forming plasma effluents of a fluorine-containing precursor;
• and
• contacting the nickel-containing alloy with the plasma effluents of the fluorine-containing precursor, wherein the contacting fluorinates a portion of the nickel-containing alloy to form a nickel-and-fluorine-containing material overlying the nickel-containing alloy.

A method for coating a component of a semiconductor processing system, the method comprising:

• removing a native oxide from an exposed surface of the component of the semiconductor processing system;
• forming a nickel-containing alloy on the exposed surface the component of the semiconductor processing system;
• forming plasma effluents of a fluorine-containing precursor;
• and
• contacting the nickel-containing alloy with the plasma effluents of the fluorine-containing precursor, wherein the contacting fluorinates at least portion of the nickel-containing alloy to form a nickel-and-fluorine-containing material on the expose surface.