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AssigneeAvago Technologies International Sales Pte. Limited
InventorsJason T. Gentry, AJ Tufano
Estimating the term…
The subject technology is directed to systems and methods for enhancing die-to-die connectivity in semiconductor devices. According to an embodiment, the subject technology provides a device that includes a first layer comprising a first block and a second layer comprising a second block. The device further includes a third layer coupled to and positioned between the first and second layers. The first and second layers are aligned at a first region of the first connection, based on a set of design strategies. Embodiments of the subject technology enable automated and efficient routing of signals across dice, accommodating multiple instantiations of circuit blocks with various orientations. This ensures minimal signal path length and high-density interconnects by minimizing the physical footprint of connections and adhering to stringent design rule checks within a 3D integrated circuit layout. There are other embodiments as well.
A device comprising:
A method comprising:
The method of claim 11, further comprising determining a first pin configuration characterizing the first pin and the second pin based on the mapping of the third region and the fourth region on the reference block.
A device comprising:
The device of claim 15, wherein the first block comprises a multiply-instantiated block.
The device of claim 19, wherein the first connection is associated with the second connection.
Dependencies are inferred from the claim text.