Optics-Based Distributed Unified Memory System

An integrated circuit, comprising:

• a memory die package having one or more co-packaged dies, wherein the memory die package includes:
• an optical interface configured to receive, via an optical fiber, memory requests from one or more processors;
• a memory controller coupled to a memory and configured to service the memory requests;
• and
• a cache of the memory configured to store a portion of data stored in the memory.

An integrated circuit, comprising:

• a compute die package having one or more co-packaged dies, wherein the compute die package includes:
• one or more processors configured to execute program instructions that operate on data stored in a distributed memory accessible via a unified memory architecture;
• and
• an optical interface configured to send, via an optical fiber, memory requests to one or more memory die packages configured to implement the unified memory architecture.