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US 2025/0093774 A1Published application
Resist under-layer for use in a lithographic apparatus
AssigneeASML Netherlands B.V.
InventorSander Frederik WUISTER
Life of this patent
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Abstract
A substrate arrangement for use in a lithographic apparatus, the substrate arrangement including: a resist; a photosensitive resist under-layer; and a substrate, wherein an exposure threshold of the resist under-layer is lower than an exposure threshold of the resist. The resist and the resist under-layer may be both photosensitive to EUV radiation.
Claims21
A substrate arrangement for use in a lithographic apparatus, the substrate arrangement comprising:
- a resist;
- a photosensitive resist under-layer;
- and
- a substrate,
- wherein an exposure threshold of the resist under-layer is lower than an exposure threshold of the resist.
2 more elements
A method of manufacturing a substrate arrangement, the method comprising:
- coating a surface of a substrate with a photosensitive resist under-layer;
- and
- providing a resist on the photosensitive resist under-layer,
- wherein an exposure threshold of the resist under-layer is lower than an exposure threshold of the resist.
1 more element
(canceled)
Dependencies are inferred from the claim text.