Template substrate and manufacturing method and manufacturing apparatus thereof, semiconductor substrate and manufacturing method and manufacturing apparatus thereof, semiconductor device, and electronic device
AssigneeKYOCERA Corporation
InventorsTakeshi KAMIKAWA, Yuta AOKI, Toshihiro KOBAYASHI
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Abstract
A template substrate includes a main substrate containing silicon and including an edge, a mask located above the main substrate and including an opening portion, a seed portion located at the opening portion above the main substrate, and a protecting portion overlapping the edge when viewed from a side and containing a material different from gallium.
Claims21
A template substrate comprising:
- a main substrate containing silicon and comprising a side surface;
- a mask pattern located above the main substrate and comprising an opening portion;
- a underlying layer that is located above the main substrate and overlaps the mask pattern;
- and
- a protecting portion overlapping the side surface in a side view and containing a material different from gallium, wherein
- the protecting portion and the underlying layer overlap in a plan view.
-28. (canceled)
A method for manufacturing a template substrate comprising a main substrate containing silicon and comprising a side surface, a mask pattern located above the main substrate and comprising an opening portion, and an underlying layer that is located above the main substrate and overlaps the mask pattern, the method comprising:
- forming a protecting portion so as to overlap the underlying layer in a plan view, the protecting portion overlapping the side surface in a side view and containing a material different from gallium.
Dependencies are inferred from the claim text.