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US 2025/0093600 A1Published application
Integration of oe devices with ics
AssigneeAvicenaTech, Corp.
InventorsRobert Kalman, Bardia Pezeshki, Cameron Danesh, Alexander Tselikov
Life of this patent
Estimating the term…
Abstract
Optical interconnects for IC chips may include optical sources and receivers integrated with the IC chips. MicroLEDs may be mounted on an interconnect layer of the IC chip, and embedded within a waveguide. Photodetectors to receive light from the waveguide may be fabricated in a top surface of a semiconductor substrate, below a level of the interconnect layer, but with a passageway for light through the interconnect layer.
Claims7
-9. (canceled)
A portion of an optical interconnect for integrated circuit (IC) chips, comprising:
- a first semiconductor substrate containing transistors;
- a first stack of interconnect layers on top of the first semiconductor substrate, the interconnect layers including alternating metal and dielectric layers, the first semiconductor substrate and the first stack of interconnect layer providing an integrated circuit;
- a microLED bonded to a surface of the integrated circuit, on the first stack of interconnect layers, with at least one electrical connection coupling the microLED and at least one transistor of the semiconductor substrate;
- and
- a substrate, with the integrated circuit attached to the substrate by solder bumps.
2 more elements
11-17. (canceled)
Dependencies are inferred from the claim text.