Semiconductor package including photonic integrated circuit chip

A semiconductor package comprising:

• a package substrate including at least a first alignment hole extending inwardly from a side surface of the package substrate;
• a photonic integrated circuit chip disposed on the package substrate, the photonic integrated circuit chip including a groove extending inwardly from a side surface of the photonic integrated circuit chip and a photo-electron converter including a plurality of terminal end couplers;
• a semiconductor chip disposed on the package substrate;
• and
• an optical fiber connector including a frame, a plurality of optical fibers penetrating through the frame, and at least a first alignment pin extending from the frame to an inside of the first alignment hole,
• wherein the plurality of terminal end couplers are located at a first end of the photo-electron converter.

A semiconductor package comprising:

• a package substrate including at least a first alignment hole extending inwardly from a side surface of the package substrate;
• a photonic integrated circuit chip disposed on the package substrate, the photonic integrated circuit chip including a groove extending inwardly from a side surface of the photonic integrated circuit chip and a photo-electron converter including a plurality of terminal end couplers;
• a semiconductor chip disposed on the package substrate;
• an electronic integrated circuit chip disposed on an upper surface of the photonic integrated circuit chip;
• and
• an optical fiber connector including a frame, a plurality of optical fibers penetrating through the frame and mounted in the groove, and at least a first alignment pin extending from the frame to an inside of the first alignment hole,
• wherein the plurality of terminal end couplers are located at one end of the photo-electron converter, and
• wherein the first alignment hole of the package substrate is apart from upper and lower surfaces of the package substrate.