Test socket for a component
AssigneeSamsung Electronics Co., Ltd.
InventorJee-Hoon Ka
Life of this patent
Estimating the term…
Abstract
A test apparatus includes an image sensor module including a controller configured to generate a pulse width modulation signal to control a temperature of an image sensor module to be tested, and a test socket configured to emit heat to the image sensor module based on the pulse width modulation signal. The controller may control a duty ratio of the pulse width modulation signal based on a current temperature of the image sensor module, a target temperature and a criteria temperature range, and the criteria temperature range is a temperature range within a preset range from the target temperature.
Claims20
A test apparatus comprising:
- a controller configured to generate a pulse width modulation signal to control a temperature of an image sensor module to be tested, and
- a test socket configured to emit heat to the image sensor module based on the pulse width modulation signal,
- wherein the controller is configured to control a duty ratio of the pulse width modulation signal based on a current temperature of the image sensor module, a target temperature and a criteria temperature range, and
- the criteria temperature range is a temperature range within a preset range from the target temperature.
A test socket comprising:
- a cover covering an upper portion of an image sensor module to be tested;
- an aperture configured to open and close based on an aperture control signal;
- a heater configured to turn on and off based on a pulse width modulation signal and configured to emit heat to the image sensor module to cause a current temperature of the image sensor module to reach a target temperature;
- a socket temperature sensor configured to measure the current temperature;
- a bottom plate disposed below the image sensor module and accommodating the heater and the socket temperature sensor;
- and
- a support supporting the bottom plate.
A test method comprising:
- receiving predetermined field of view (FOV) information and a target temperature for temperature evaluation of an image sensor module to be tested;
- receiving a current temperature inside a test socket;
- controlling the test socket, based on the current temperature being outside a criteria temperature range and based on the current temperature being lower than the target temperature, to cause the current temperature to increase using a pulse width modulation signal;
- controlling the test socket, based on the current temperature being within the criteria temperature range and based on the current temperature being lower than the target temperature, to cause the current temperature to decrease using the pulse width modulation signal;
- controlling the test socket based on the FOV information and driving the image sensor module to capture an image based on the current temperature being maintained at the target temperature for a predetermined time;
- and
- outputting a result of the temperature evaluation of the image sensor module, the temperature evaluation based on the captured image.
Dependencies are inferred from the claim text.