Heat dissipation devices for channel cooling section and application methods thereof

Abstract

The present disclosure provides an embodiment of a heat dissipation device for a channel cooling section and an application method, belonging to a field of substrate glass manufacturing technology. The device includes a side refractory brick, a top refractory brick, a bottom supporting refractory brick, and at least one heat sink. The side refractory brick includes a first side refractory brick and a second side refractory brick. The first side refractory brick and the second side refractory brick are arranged opposite to each other. The top refractory brick is spliced above the first side refractory brick and the second side refractory brick, while the bottom supporting refractory brick is spliced below the first side refractory brick and the second side refractory brick. A cavity structure is formed after the splicing is completed. The first side refractory brick, the second side refractory brick, and the top refractory brick are arranged with a plurality of heat dissipation gaps, and at least one of these gaps is installed with the at least one heat sink. The present disclosure can effectively enhance the heat dissipation efficiency of the channel cooling section and is flexible, controllable, and can be used on a large scale.

Dependencies are inferred from the claim text.