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US 2025/0087539 A1Published application
Scan testable through silicon vias
AssigneeTexas Instruments Incorporated
InventorLee D. Whetsel
Life of this patent
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Abstract
The disclosure describes a novel method and apparatus for testing different types of TSVs in a single die or different types of TSV connections in a stack of die. The testing is facilitated by test circuitry associated with each type of TSV. The test circuitry includes a scan cell adapted for testing TSVs.
Claims20
A system comprising:
- a first die including a first test circuit;
- and
- a second die including:
- a through-silicon via (TSV) coupled to the first test circuit of the first die;
- a first transistor including a first current terminal coupled to the TSV, wherein the first transistor includes a second current terminal;
- a second transistor coupled to the second current terminal of the first transistor;
- and
- a second test circuit coupled to the second current terminal of the first transistor.
5 more elements
A system comprising:
- a first die including:
- a first test circuit;
- and
- a through-silicon via (TSV) coupled to the first test circuit;
- and
- a second die including:
- a first transistor including a first current terminal coupled to the TSV of the first die, wherein the first transistor includes a second current terminal;
- a second transistor coupled to the second current terminal of the first transistor;
- and
- a second test circuit coupled to the second current terminal of the first transistor.
7 more elements
A system comprising:
- a first die including a test circuit;
- a through-silicon via (TSV) coupled to the test circuit;
- and
- a second die including:
- a first transistor including a first current terminal coupled to the TSV of the first die, wherein the first transistor includes a second current terminal and a control terminal;
- a second transistor coupled to the second current terminal of the first transistor;
- a flip-flop coupled to the control terminal of the first transistor;
- and
- a comparator coupled to the second current terminal of the first transistor.
6 more elements
Dependencies are inferred from the claim text.