Thermal Power Budget Optimization Method, Heating device and Thermal Power Budget Optimization System

A heating device, comprises:

• a plurality of sensors;
• at least one heating source;
• a storage device;
• a cache memory;
• a processor coupled to the plurality of sensors, the at least one heating source, the storage device, and the cache memory;
• and
• a case configured to cover the plurality of sensors, the at least one heating source, the storage device, the cache memory, and the processor;
• wherein the processor is configured to acquire sensor log information from the plurality of sensors of the heating device, the processor is further configured to generate a virtual surface temperature of the heating device according to the sensor log information, the processor is further configured to set a target surface temperature of the heating device, the processor is further configured to dynamically adjust a thermal power budget of the heating device according to the virtual surface temperature and the target surface temperature over time, and the sensor log information, the virtual surface temperature, the target surface temperature, and the thermal power budget are buffered in the cache memory.

A thermal power budget optimization system comprising a heating device, a memory, and a first processor coupled to the heating device and the memory, wherein the heating device comprises:

• a plurality of sensors;
• at least one heating source;
• a storage device;
• a cache memory;
• a second processor coupled to the plurality of sensors, the at least one heating source, the storage device, and the cache memory;
• and
• a case configured to cover the plurality of sensors, the at least one heating source, the storage device, the cache memory, and the second processor;
• wherein the second processor is configured to acquire sensor log information from the plurality of sensors of the heating device, the second processor is further configured to generate a virtual surface temperature of the heating device according to the sensor log information, the second processor is further configured to set a target surface temperature of the heating device, the second processor is further configured to dynamically adjust a thermal power budget of the heating device according to the virtual surface temperature and the target surface temperature over time, and the sensor log information, the virtual surface temperature, the target surface temperature, and the thermal power budget are buffered in the cache memory.