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US 2025/0085633 A1Published application
Thick film resist composition and method for manufacturing resist film using the same
AssigneeMerck Patent GmbH
InventorsMasato SUZUKI, Hiroshi YANAGITA, Takayuki SAO
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Abstract
[Problem] To provide a thick film resist composition capable of forming a resist pattern with high rectangularity. [Means for Solution] A thick film resist composition comprising a polymer (A), a deprotecting agent (B), a particular carboxylic acid compound (C) and a solvent (D).
Claims21
-15. (canceled)
A thick film resist composition comprising a polymer (A), a deprotecting agent (B), a C4-12 carboxylic acid compound (C) and a solvent (D),
- wherein
- the resist film formed from the thick film resist composition has a film thickness of 0.8 to 20 μm;
- the carboxylic acid compound (C) is an unsaturated hydrocarbon comprising 1, 2 or 3 carboxy groups;
- and
- the solvent (D) comprises an organic solvent (D1).
2 more elements
Dependencies are inferred from the claim text.