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US 2025/0085472 A1Published application
Optical devices
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Chung-Hao Tsai, Chieh-Yen Chen
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Abstract
Optical devices are presented herein. In an embodiment, the optical devices comprise a first active layer of first optical components, a first metallization layer over the first active layer, a first capacitor located within the first metallization layer, a first bond layer over the first metallization layer, and a first semiconductor device bonded to the first bond layer.
Claims20
A semiconductor device comprising:
- a first active layer of first optical components;
- a first metallization layer over the first active layer;
- a first capacitor located within the first metallization layer;
- a first bond layer over the first metallization layer;
- and
- a first semiconductor device bonded to the first bond layer.
3 more elements
A semiconductor device comprising:
- a first semiconductor device bonded to a first bond layer;
- a first metallization layer on an opposite side of the first bond layer from the first semiconductor device;
- a first active layer of first optical components on an opposite side of the first metallization layer from the first bond layer;
- and
- a first capacitor on an opposite side of the first active layer from the first metallization layer.
2 more elements
A semiconductor device comprising:
- an interposer structure, the interposer structure comprising;
- a semiconductor substrate;
- a deep trench capacitor extending into the semiconductor substrate;
- and
- a metallization layer over the semiconductor substrate, the metallization layer comprising first optical components;
- a first optical structure bonded to the interposer structure, the first optical structure comprising:
- a first semiconductor device;
- a first active layer of first optical components;
- a first metallization layer between the first semiconductor device and the first active layer;
- and
- a first capacitor between the first semiconductor device and the interposer structure;
- and
- a second optical structure bonded to the interposer structure, the second optical structure comprising:
- a second semiconductor device;
- a second active layer of second optical components;
- a second metallization layer between the second semiconductor device and the second active layer;
- and
- a second capacitor between the second semiconductor device and the interposer structure.
15 more elements
Dependencies are inferred from the claim text.