Low cross-talk interconnection device with impedance-tuned hybrid shielding structures for integrated circuit device test tooling

A contactor assembly including a bushed block with dielectric bushings useful for testing a packaged integrated circuit device under test (DUT), the contactor assembly comprising:

• a first block having a first plurality of probe pin openings enabling a first plurality of contact pins of a plurality of compressible probes to protrude;
• a second block having a second plurality of probe pin openings enabling a second plurality of contact pins of the plurality of compressible probes to protrude;
• wherein the first block and the second block are configured to be coupled to each other to form a plurality of probe retention cavities for housing a plurality of depressible probes configured to repeatedly maintain reliable electrical contact with a corresponding plurality of DUT contact pads when under a compliant force, wherein each of the compressible probes has a probe barrel which is contained within its probe retention cavity and oppositely extending first and second contact pins, the oppositely extending contact pins of each of the compressible probes being depressible in the probe barrel;
• and
• wherein at least one of the first block and the second block is a bushed block made from a conductive material, wherein the bushed block includes an array of bushing pockets and a corresponding plurality of dielectric bushings secured inside the array of bushing pockets, wherein one of the first plurality of contact pins and the second plurality of contact pins is a corresponding plurality of bushed contact pins;
• and
• wherein the plurality of dielectric bushings are fabricated by:
• machining the array of bushing pockets in the bushed block of the contactor assembly, and wherein the array of bushing pockets are arranged in a pattern matching the plurality of DUT contact pads;
• forming a corresponding plurality of protrusions from a dielectric material, wherein the plurality of protrusions extends from a dielectric base, wherein the plurality of dielectric protrusions are arranged in the pattern matching the plurality of contact pads of the DUT, and wherein the plurality of dielectric protrusions are accommodated inside the array of bushing pockets;
• machining away the dielectric base from the bushed block thereby forming a plurality of dielectric plugs in the bushed block, and wherein tops of the plurality of dielectric plugs are flush with a surface of the bushed block;
• and
• machining a plurality of holes within the plurality of dielectric plugs to form the plurality of dielectric bushings, wherein the plurality of holes are configured to enable the plurality of bushed contact pins to protrude from the surface to make electrical contact with the plurality of DUT contact pads.

A method for fabricating a contactor assembly having improved dielectric insulation, the method comprising:

• machining an array of bushing pockets in a bushed block of the contactor assembly, wherein the contactor assembly includes an upper block and a lower block, wherein the upper block and the lower block are configured to be coupled to each other to house a plurality of depressible probes, wherein the bushed block is one of the upper block and the lower block, wherein the contactor assembly is configured to detachably make electrical contact with a plurality of contact pads of a Device-Under-Test (DUT), and wherein the array of bushing pockets are arranged in a pattern matching the plurality of contact pads of the DUT;
• filling the array of bushing pockets with a moldable dielectric material, and wherein the array of bushing pockets functions as a mold;
• machining away any excess moldable dielectric material from the bushed block thereby forming a plurality of dielectric plugs in the bushed block, and wherein tops of the plurality of dielectric plugs are flush with a surface of the bushed block;
• and
• machining a plurality of pin openings within the plurality of plugs to form a plurality of dielectric bushings, wherein the plurality of pin openings are configured to enable a plurality of contact pins of the plurality of depressible probes to protrude from the surface to make electrical contact with the contact pads of the DUT.