Low stress packaging for environmental sensors

A device comprising:

• a first sensor device disposed on a top surface of carrier substrate adjacent to first recessed channel in the carrier substrate;
• a volume of elastomer material disposed on the carrier substrate that encapsulates the first sensor device;
• and
• a cover disposed above the volume of elastomer material;
• wherein the volume of elastomer material has a first height above the carrier substrate in a first region above the first sensor device;
• wherein a portion of the volume of elastomer material fills the first recessed channel to form a first flanged area that is recessed below the first height in a second region adjacent to the first region;
• and
• wherein the cover is bonded to the first flanged area in the second region that overlies the volume of elastomer material such that the cover is separated from the volume of elastomer material by a gap within the first region.